TSMC breaks ground on advanced packaging facility in north Phoenix

Article originally posted on Phoenix Business Journal on April 24, 2026

Taiwan Semiconductor Manufacturing Co. is planning to open its first advanced packaging facility at its north Phoenix site by 2029, according to a recent Reuters report.

During a conference held Wednesday in Santa Clara, California, TSMC executives said the company has started initial work on its fourth Phoenix chip factory and broke ground on an advanced packaging facility as part of its plans to expand manufacturing capacity in Arizona, Reuters reported.

“We are going to build a (chips on wafer on substrate) capability and (3D integrated circuit capability) there before ​2029, so that’s still our goal,” Kevin Zhang, TSMC’s deputy co-chief operations officer and senior vice president told Reuters, referring to two of the company’s ​packaging technologies.

C.C. Wei, TSMC’s CEO, had previously broken the news during a January earnings call that the company was in the process of applying for permits to begin construction of its first advanced packaging plant at its north Phoenix fab site but did not provide a completion date for the project, the Business Journal previously reported.

Under the company’s current $165 billion investment, TSMC is building out a total of six chip fabs, two chip packaging facilities and an R&D center in a construction timeline that already extends beyond 2030.

A TSMC spokesperson declined to comment on the Reuters report but confirmed that TSMC shared during its Tech Symposium event on Wednesday that it started the initial stages of construction on both its fourth wafer fab and first advanced packaging facility in north Phoenix.

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