Amkor increases investment in new Arizona facility to $12 billion Article originally posted on AZ Big Media on September 10, 2026 Amkor Technology is dramatically expanding its Arizona footprint as a new strategic partnership with NVIDIA accelerates plans to build advanced semiconductor packaging capacity in the United States. The Tempe-based semiconductor packaging and test company announced Phase 2 of its Arizona advanced packaging and test campus after customer commitments surpassed the 33,000 square meters of cleanroom capacity planned for Phase 1. Phase 2 is expected to add 60,000 square meters of cleanroom space, bringing the 170-acre campus to approximately 93,000 square meters and increasing Amkor’s planned investment in Arizona to approximately $12 billion. The expanded campus is expected to support more than 3,500 Arizona-based employees. “This next phase reflects the confidence our customers have placed in Amkor, the critical role advanced packaging plays in enabling the future of semiconductor innovation, and the strategic importance of our Arizona campus,” said Kevin Engel, president and CEO of Amkor Technology. The expansion comes as Amkor announced a multiyear strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation artificial intelligence and accelerated computing platforms. Under the agreement, NVIDIA will provide a prepayment supporting the expansion of Amkor’s U.S. advanced packaging capacity. The companies will align their long-term technology roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration. Amkor has already provided advanced packaging solutions for NVIDIA products spanning data center processors, networking chipsets and accelerated computing systems. The partnership is designed to bring new technologies to market at scale as demand for AI infrastructure grows. “AI is driving a generational shift in technology, transforming every industry and creating a unique opportunity to reinvigorate American manufacturing and supply chains,” said Debora Shoquist, executive vice president of operations at NVIDIA. Amkor’s Arizona campus is designed to include wafer bump, probe, assembly and test capabilities, creating a full domestic turnkey manufacturing platform. According to the company, it will be the first U.S. outsourced semiconductor assembly and test production site providing advanced packaging at high volume. Construction on Phase 2 is expected to begin in late 2027 and be completed by the end of 2029. The campus was designed as a multiphase development, leaving room for additional expansion as customer demand grows. Together, the $12 billion investment and NVIDIA partnership further strengthen Arizona’s growing role in the semiconductor and AI supply chains while expanding domestic capacity for increasingly complex chips. Amkor’s Arizona campus is the first OSAT production site in the U.S. for advanced packaging in high volume, giving customers access to a full domestic turnkey manufacturing platform. Construction of phase 2 is anticipated to begin late 2027, with completion expected by the end of 2029. Amkor’s Arizona 170-acre campus allows for further expansion as needed to support customer demand. “Today, we celebrate another massive investment into Greater Phoenix. Amkor’s additional commitment secures Greater Phoenix’s position as the hub for the most advanced packaging and most comprehensive supply chain in the U.S.,” said Greater Phoenix Economic Council President & CEO Christine Mackay. “We congratulate Peoria and other partners on this expansion, which provides new job creation, opportunities for workforce and talent pipeline growth, and strengthened partnerships, and we look forward to the widespread effects that will drive the entire region’s semiconductor ecosystem forward.”